Provision of One Unit of Fully Automated Chip to Wafer Flip Chip Bonder with In-situ treatment.
Agency for Science, Technology and Research tender for Professional Services & Consulting, worth S$2.2M, published in November 2025 — one of 966 records from this buyer, above its typical contract value.
Buying agency
Agency for Science, Technology and ResearchWinner
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Contract description
Provision of One Unit of Fully Automated Chip to Wafer Flip Chip Bonder with In-situ treatment.
Other tenders · Agency for Science, Technology and Research
966 tendersThe buyer's full award list ranked by value, with the winning supplier, date and sector on every row — plus CSV / API export.
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- NST000ETT25000139S$323M30 Mar 2026 Healthcare
- NST000ETT24000112S$138M26 May 2025 Professional Services
- NST000ETT22000072S$43.4M05 Jan 2023 Construction
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