Provision of One (1) Unit of Fully Automated Die-to-Wafer Surface Preparation Equipment and/or Die-to-Wafer Bonder
Agency for Science, Technology and Research awarded S$4.9M to APPLIED MATERIALS SOUTH EAST ASIA PTE. LTD. for IT & Software in March 2026 — one of 902 awards this buyer has made, above its typical award size. GeBIZ publishes 2 supplier awards under NST000ETT25000033.
Buying agency
Agency for Science, Technology and ResearchWinning supplier
APPLIED MATERIALS SOUTH EAST ASIA PTE. LTD.Contract description
Provision of One (1) Unit of Fully Automated Die-to-Wafer Surface Preparation Equipment and/or Die-to-Wafer Bonder
Related awards · Agency for Science, Technology and Research
902 awardsThe buyer's full award list ranked by value, with the winning supplier, date and sector on every row — plus CSV / API export.
- NST000ETT25000139WOH HUP (PRIVATE) LIMITEDS$323M30 Mar 2026 Healthcare
- NST000ETT24000112HEWLETT-PACKARD SINGAPORE (SALES) PTE. LTD.S$138M26 May 2025 IT
- NST000ETT22000072D-TEAM ENGINEERING PTE. LTD.S$43.4M05 Jan 2023 Construction
Other wins · APPLIED MATERIALS SOUTH EAST ASIA PTE. LTD.
6 winsThe supplier's complete win history across every buyer it sells to — not just the handful shown here.
- NST000ETT25000064Agency for Science, Technology and ResearchS$13.1M27 Nov 2025 IT
- NST000ETT25000065Agency for Science, Technology and ResearchS$4.9M10 Nov 2025 IT
- NST000ETT24000075Agency for Science, Technology and ResearchS$4.2M06 Jan 2025 IT
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