Provision of One (1) Unit of Fully Automated Die-to-Wafer Surface Preparation Equipment and/or Die-to-Wafer Bonder
Agency for Science, Technology and Research tender for Professional Services & Consulting, worth S$7.5M, published in March 2026.
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Contract description
Provision of One (1) Unit of Fully Automated Die-to-Wafer Surface Preparation Equipment and/or Die-to-Wafer Bonder
Other tenders · Agency for Science, Technology and Research
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- NST000ETT25000125S$320K02 Mar 2026 IT
- NST000ETT25000126S$126 Feb 2026 Professional Services
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