Provision of One Unit of Fully Automated Chip to Wafer Flip Chip Bonder with In-situ treatment.
Agency for Science, Technology and Research tender for Professional Services & Consulting, worth S$2.2M, published in November 2025.
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Contract description
Provision of One Unit of Fully Automated Chip to Wafer Flip Chip Bonder with In-situ treatment.
Other tenders · Agency for Science, Technology and Research
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- NST000ETT25000099S$288K31 Oct 2025 IT
- NST000ETT25000083S$1.3M27 Oct 2025 Professional Services
- NST000ETT25000074S$436K22 Oct 2025 Professional Services
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