Singapore GeBIZ contract award · NST000ETT25000036
Provision of One Unit of Fully Automated Chip to Wafer Flip Chip Bonder with In-situ treatment.
Agency for Science, Technology and Research awarded S$2.2M to Kulicke & Soffa Private Limited for IT & Software in November 2025 — one of 902 awards this buyer has made, above its typical award size.
Services IT & Software
04 Nov 2025
Award date
S$2.2M
Contract value
Buying agency
Agency for Science, Technology and Research 902 Awards
S$1.6M Avg award
Above vs typical
Winning supplier
Kulicke & Soffa Private Limited 1 Award
1 Buyer
S$2.2M Total won
Contract description
Provision of One Unit of Fully Automated Chip to Wafer Flip Chip Bonder with In-situ treatment.
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Related awards · Agency for Science, Technology and Research
902 awardsThe buyer's full award list ranked by value, with the winning supplier, date and sector on every row — plus CSV / API export.
Tender no.SupplierAmountDateSector
- NST000ETT25000139WOH HUP (PRIVATE) LIMITEDS$323M30 Mar 2026 Healthcare
- NST000ETT24000112HEWLETT-PACKARD SINGAPORE (SALES) PTE. LTD.S$138M26 May 2025 IT
- NST000ETT22000072D-TEAM ENGINEERING PTE. LTD.S$43.4M05 Jan 2023 Construction
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